High performance co-operation plans Huawei signed a Memorandum of Understanding (MoU) with Paris-based ESI Group (ESI) at the CONNECT event in Shanghai. The two parties will collaborate on High-Performance Computing (HPC) and cloud computing to provide industrial manufacturing solutions for customers worldwide.
ESI’s virtual reality solution enables the Huawei HPC platform to provide customers with digital equipment room layouts that are of the same proportion to those of the physical environments they replicate. Leveraging virtual reality technology, designers can keep improving virtual prototypes during product R&D to reduce the need for physical prototypes, which can result in a reduction in design costs and shorter product development cycles
The MoU signed by the two parties includes multiple cooperation plans. One is to build a joint innovation centre in Munich, Germany to enable the two parties to verify and innovate cloud computing and HPC solutions based on ESI’s industrial simulation test applications and Huawei’s leading IT productions and platforms. Another is to build a global experience centre in Hangzhou, China that will allow customers to experience the latest products and service training sessions
The two parties also agreed to initiate a series of cooperation projects worldwide to jointly promote and deliver innovative cloud computing and HPC product R&D and simulation solutions. All these cooperative efforts will provide global customers with innovative R&D technologies to help them address challenges brought by the exponential growth of technology in the future.